本章参考文献
[1] Kawase Y and Ichihashi T.Heat analysis of thermal overload relays using 3-D finite element method[J].IEEE Trans on Magnetics,1999,35(3):1658-1661.
[2] Barcikowski F,Lindamayer M.Simulations of the heat balance in low-voltage switchgear[J].Proceedings of20th International Conference on Electrical Contacts,Sweden,2000:323-329.
[3] Paulke J,Weichert H,Steinhaeuser P.Thermal simulation of switchgear[J].IEEE Transactions on Compo-nents and Packaging Technologies,2002,25(3):6-11.
[4] Frei PU,Weichert H..Advanced thermal simulation of a circuit breaker[C].Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts,Seattle,
2004:104-15.
[5] X.Z.Meng.Lifetime Predictions of Miniature Fuses and Semiconductor Protection Fuses[D].Doctorate Thesis of Eindhoven Universityof Technology,1996.
[6] 陈德桂,辜晓川,蒋容兴,等.瞬态热路法计算小型断路器热脱扣器的动作特性[J].低压电器,1995(1):17-21.(https://www.daowen.com)
[7] Leung CH.,Lee A,and Wang BJ.Thermal modeling of electrical contacts in switches and relays[J].IEEE Trans on Components,Packaging and Manufacturing Technology,1996,19(3):346-352.
[8] Leung CH.,Doduco AMI.Thermal analysis of a molded case circuit breaker[C].The proceedings of the23rd International Conference on Electrical Contacts,Sendai,2006:590-595.
[9] Steffen Grossmann,Helmut Lobl,Uwe Kaltenborn.ABB and the Technical university of Dresden Collabrora-tion on the Thermal Design of Power Equipment[J].ABB Review 2/2005:55-58.
[10] 黄琳敏.典型低压电器温度场和热路的仿真分析[D].西安:西安交通大学,2003.
[11] Qu JY,Chong F,Wu G,et al.Application of computational fluid dynamics to predict the temperature-rise of low voltage switchgear compartment[C].IEEE Holm Conference on Electrical Contacts,2014:87-91.